B15-013 EXPERIMENTAL AND NUMERICAL EVALUATION OF THE EFFECTS OF COMPONENT PACKAGING ON CONVECTIVE HEAT LOSSES IN A HIGH POWER AMPLIFIER
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概要
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The direct forced convection heat loss from transistors on high power amplifiers was investigated through experiments and numerical simulations. Using a simplified 2D model, Particle Image Velocimetry (PIV) was used to visualise the airflow across the main heat dissipating transistors and transistors. Experiments were also conducted to measure the thermal conditions within the transistors, both with and without the presence of the transformers, over a Reynolds number range 50,000 < Re < 125,000. The experiments were used to validate numerical flow and thermal results obtained using a commercial CFD code with good agreement within 6%. Finally, a wide range of simulations was conducted (using a constant static pressure at the inlet) to assess the effects of changes to the positioning and orientation of the major components on the PCB. By considering the convective heat removal rate from the transistors for each simulation the numerical data was used to determine the optimum location and orientation for the transformers on the PCB.
- 一般社団法人日本機械学会の論文
- 2003-11-30
著者
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Behnia Masud
School Of Mechanical And Manufacturing Engineering University Of New South Wales
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Behnia Masud
School Of Mechanical And Manufacturing Engineering The University Of New South Wales
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Maguire Luke
School Of Mechanical And Manufacturing Engineering University Of New South Wales
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MORRISON GRAHAM
School of Mechanical and Manufacturing Engineering, University of New South Wales
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Morrison Graham
School Of Mechanical And Manufacturing Engineering University Of New South Wales
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BEHNIA Masud
School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney
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