Σ3 {111} およびΣ9 {221} 粒界を有する銅双結晶の再結晶において結晶粒界が果たす役割

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Copper bicrystals with Σ3 {111} and Σ9 {221} boundaries were defotmed in tension and annealed for 900 sec at temperatures between 773K and 1273K.Noticing grain and grain-boundary orientations of the specimens,the effects of grain boundaries on the recrystallization were disussed.In the case of the bicrystal where both of the primary slip planes in the gains wwere parallel to a grain boundary,the recrystallization behavior was almost the same with that of the single ctystal of the component grain.On the other hand,in the bicrystals where the primary slip planes in grains were intersected at the grain boundaries,the grain boundaries in the bicrystals lowered the temperatures of appearance of new grains.The new grains were preferentially observed on the grain boundaries.In the case of the speimens where double slips took place in the grains from the early stage of deformation,no effect of grain boundaries on recrystallization was observed.The single crystal with double slips showed the lower temperature of appearance of new grains than those of the single crystals with single slips.Although the deformation behavior of bicrystals with Σ3 {111} and Σ9 {221} boundaries was almost the same at room temperature,the recrystallization of the bicrystal with the Σ9 {221} boundary was easier.The deffernce in recrystallization behavior corresponded to the reported result that the grain-boundary deffusion coefficient of a Σ9 {221} boundary was much larger than that of a Σ3 {111} boundary.
社団法人日本材料学会の論文
1993-07-15

Σ3 {111} およびΣ9 {221} 粒界を有する銅双結晶の再結晶において結晶粒界が果たす役割

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