アルミナ基板上へのNi-P合金皮膜の高電流密度電析

概要

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Ni-P alloy film was electrodeposited at 5〜232A・dm^<-2> on an alumina substrate by using the electroplating apparatus equipped with a high flow rate circular pump. With increasing current density, the current efficiency for the deposition on Ni-P decreased once. When the current efficiency was minimum, the P content in the film obtained in the electrolytes with various pH was always 7.5wt%. In the X-ray diffraction profile of Ni-P film with 7.5wt% P content, (200)diffraction peak disappeared and only(111)peak became strong. The overpotential of hydrogen evolution on the Ni-P film with 7.5wt% P content became minimum. The current efficiency, P content, crystal structure and overpotential of hydrogen evolution were closely related one another. TCR of Ni-P alloy film was correlate with its P content.
社団法人日本材料学会の論文
1996-05-15