予き裂を導入した試験片による熱衝撃特性の評価

概要

論文の詳細を見る
Thermal shock resistance of sillicon nitride was evaluated by a quenching test using precracked specimens and molten solder as a cooling medium. A thermal shock parameter, R_C(=ΔT_C^*・√<C>), which corresponds to fracture toughness and is obtained easily from a general quenching test has been defined. Here, C is the half length of a precrack and ΔT_c^* is the applied temperature difference when the first small propagation of the precrack is observed. As a result, it was confirmed that R_C is almost constant regardless of the crack length and temperature dependence of material properties. In addition, a critical temperature difference for an un-cracked specimen was predicted from ΔT_C^* and C using an equivalent crack length of natural fracture origin. This numerical prediction was also applied to the estimation of the thermal shock resistance of other ceramics.
社団法人日本セラミックス協会の論文
1995-06-01