細密リードのレーザはんだ付に関する研究(第1報) : 新方式の概念実証とはんだ流動制御

概要

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This paper describes the development of a new laser soldering technique for surface mount assemblies. The new technique, using a focused YAG laser beam, has a superior performance. It can be applied to TCP (Tape Carrier Package) assemblies for fine pitch leads and offers a no-bridge soldering process. In this paper, the performance of the new technique is evaluated experimentally. First, the new technique is compared with the conventional laser-soldering technique in TCP assembly. As a result, the no-bridge soldering concept is proved by the new technique. Second, to obtain more flexibility in assembly, the solder flow is investigated by a beam scanning method. The beam scanning direction is determined by the analysis of the solder flow mechanism. From these experiments, the new technique of laser soldering offers the capacity to assemble high lead counts and fine pitch ICs such as TCP.
公益社団法人精密工学会の論文
1993-09-05