IC樹脂封止材の凝固解析 : 金型キャビティ内充てん後の温度解析

概要

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This report describes a method for the estimation of the curing process of thermosets used for plastic-encapsulated ICs. This method consists of a thermal analysis by the differential scanning calorimetry (DSC) and an analysis of non-stationary heat conduction using the finite element method (FEM) coupled with the rate of heat evolution. The formula of the rate of heat evolution deduced from the DSC data could not be directly applied to the analysis because the thermodynamic conditions in DSC were not exactly the same as that in molding process, so that a state-dependent variable α were newly introduced to correct the formula. The temperature profiles at four positions in the cavity during cure were measured with CA-thermocouples. The α was determined by inverse solution of the FEM with the measured temperatures. The obtained variation of α is expressed by a function of time after the end of filling process and the conversion of resin. With making use of the α in the calculations of temperature, the predicted temperature profiles compare reasonably well with the experimental results. It is found that this method gives propriety of curing analysis including the effect of process parameters of α to estimate the solidification front.
公益社団法人精密工学会の論文
1989-06-05