薄膜の常温接合による微小3次元形状創成法の提案と検証

概要

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This paper proposes a novel fabrication method for 3-D microstructures using surface-activated bonding (SAB) of thin films. This method is a kind of layer manufacturing method for metallic or dielectric microstructures with an accuracy of sub-micrometers. In our method named FORMULA (Formation of μ-structures by lamination), all sliced patterns for microstructures are first formed on a donor substrate at the same time, then they are transferred and laminated onto a target substrate using SAB in a vacuum chamber. The shape and thickness of each pattern have high resolution because of photolithography process. By using SAB for laminating these patterns, metallic or dielectric films can be strongly bonded at room temperature without glue. FORMULA is experimentally verified by demonstrating batch transfer of aluminum film patterns and lamination of these patterns onto the target substrate. Micro gears, multilevel binary optics, and 3-D photonic crystal are considered as promising applications of this method.
2000-08-05