薄膜の常温接合による微小3次元形状創成法における薄膜パターンの転写性に関する検討

概要

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We have been developing a novel fabrication method for 3-D microstructures using surface-activated bonding (SAB) of thin films. This method is a kind of layer manufacturing method for metallic or dielectric microstructures with an accuracy of sub-micrometers. In our method called FORMULA (Formation of μ-structures by lamination), all sliced patterns for microstructures are first formed on a donor substrate by photolithography, then they are transferred and laminated onto a target substrate using SAB. The transfer of thin film patterns without any damage is an essential in this method. Adhesion strength of thin films on the donor substrate should be controlled regarding the photolithography process and the bonding strength. The condition for the complete transfer of thin film patterns is discussed. A mechanism assuring paralleling of the bonding surfaces was effective to improve the bonding results. Uniformity in elastic contact pressure distribution over the bonding area was essential for the uniformity in bonding.
2000-07-01