無電解めっき法による UBM 形成と評価
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概要
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The advantage of forming under barrier metal using the electroless plating method, compared to electro-plating method, is that the electroless plating method requires less process steps, which means less time will be required. Normally, when applying solder to electroless nickel plated surface in phosphoric acid bath, a fragile layer of enriched phosphorus is formed between the two metals. It is also a fact that this enriched phosphorus layer is easily destroyed by external stress such as thermal stress. In this paper, we have formed a solder bump (pad) onto the surface of the under barrier metal formed using the electroless nickel plating process, controlling the phosphorus density. As a result of analyzing the movements of the phosphorus density of the joining layers before and after the several acceleration tests, we were able to see a trend that by controlling the electroless nickel plating process, we are able to regulate the phosphorus within the plating layer.
- 社団法人エレクトロニクス実装学会の論文
- 2002-01-01
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関連論文
- ICの3次元実装に関する研究
- 3次元実装モジュールの検討
- 無電解めっき法による UBM 形成と評価
- 3 次元実装モジュールの開発
- 3次元実装モジュールの検討
- 無電解めっきバンプの形成と応用, 評価
- 無電解めっき法によるUBM形成と評価 (MES2000 第10回マイクロエレクトロニクスシンポジウム)
- 3次元実装モジュールの開発 (MES2000 第10回マイクロエレクトロニクスシンポジウム)
- 無電解めっきバンプの形成と応用、評価 (MES'99 第9回マイクロエレクトロニクスシンポジウム論文集) -- (フリップチップ実装(1))
- 3次元実装モジュールの検討