フリップチップ実装用ビルドアップ多層配線板の開発

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概要

• 論文の詳細を見る

• We have developed a new technology for making the build-up "Printed Wiring Board (PWB)" which has brought the best solution to "Flip Chip Attachment (FCA)". The Build-up layers consist of a thin coating of high Tg Thermosetting epoxy resin. It has very small "Interstitial Blind Via Holes (IVH)" with 80μm Min. diameter, and can achieve finer pattern (e.g. L/S=40/40μm) than the previous subtractive process. The tighter tolerance of pattern alignment (±25μm or less), is also practical with the combination of the semi-additive process and the high-performance exposure unit.

• 社団法人エレクトロニクス実装学会の論文
• 2000-01-01

著者

• 小川 悟

  松下電工株式会社電子材料分社電子材料新事業推進部

関連論文

• フリップチップ実装用ビルドアップ多層配線板の開発

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