Effect of Working Fluids on Cut-off Grinding of Silicon by Outer Blade

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概要

• 論文の詳細を見る

• Machining a brittle material blank into a final product, cut-off grinding process, i.e. slicing process producing the wafers from silicon ingot or dicing process dividing the wafer into chips, is one of the important machining methods. The present researc

• 九州大学の論文
• 2003-03-26

著者

• SAJIMA TAKAO

  Departments of Intelligent Machinery and Systems, Kyushu University

• Onikura Hiromichi

  Department Of Intelligent Machinery & Systems Faculty Of Engineering Kyushu University

• Sajima Takao

  Department Of Intelligent Machinery And Systems Faculty Of Engineering Kyushu University

• KOSHIMA Kazuhiko

  Department of Intelligent Machinery and Systems, Faculty of Engineering Kyushu University

• Koshima Kazuhiko

  Department Of Intelligent Machinery And Systems Faculty Of Engineering Kyushu University

• ONIKURA Hiromichi

  Department of Intelligent Machinery and Systems, Faculty of Engineering Kyushu University

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