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概要

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The fixed support is assumed to be rigid theoretically, but deforms slightly due to its local flexibility practically. In this paper, the local flexibility of fixed supports bonded adhesively is investigated experimentally and analytically. As for the electronics parts which are represented by semiconductor devices and computer CPU modules, solder bonding and adhesion are usually used cosidering their electric characteristics and productivity. With the progress of large scale integration, the thermal stress in jointed parts tends to increase with an increase of the thermal density. Therefore, for the design of devices with high reliability, the structural design as well as electrical design becomes inevitable. Especially, in the analysis of the thermal stress and thermal deformation of devices, the accuracy of their analysis is influenced by the estimation of local flexibility of fixed supports bonded adhesively. To make this point clear, cantilever tests are carried out by the adhesion model, the solid model, and the aluminum base adhesion model. As a result, it is shown that the degree of the deformation, i.e. local flexibility, at the fixed supports bonded adhesively is able to be quantitatively expressed in the relation between the dimensionless parameters ξ and ζ where ξ denotes the size of the bonded support and ζ the coefficient of the foundation which is the reciprocal of the local flexibility.
東海大学の論文