The Effect of Substrate Dissolution in Brazing CP-Ti and Ti-15-3 Using Clad Ti-15Cu-15Ni Filler
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概要
- 論文の詳細を見る
The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using Ti–15Cu–15Ni filler metal has been performed in the experiment. Microstructures of infrared brazed joints are strongly related to dissolution of substrate during brazing. For the 1800 s brazed CP-Ti specimen, the depletion of Cu and Ni from the braze alloy into substrate cause eutectoid transformation of β-Ti into lamellar Ti2Cu and α-Ti. In contrast, dissolution of Ti-15-3 substrate into the molten braze during infrared brazing results in the 1800 s brazed zone alloyed with V, stabilizing the β-Ti to room temperature.
- 社団法人 日本鉄鋼協会の論文
- 2010-03-15
著者
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Chang C.
Engineered Materials Solutions
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WU Z.
Department of Materials Science and Engineering, National Taiwan University
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SHIUE R.
Department of Materials Science and Engineering, National Taiwan University
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Wu Z.
Department Of Epidemiology Beijing Institute Of Heart Lung And Blood Vessel Diseases
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YEH T.
Department of Materials Science and Engineering, National Taiwan University
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Shiue R.
Department Of Materials Science And Engineering National Taiwan University
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Yeh T.
Department Of Materials Science And Engineering National Taiwan University
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Wu Z.
Department Of Materials Science And Engineering National Taiwan University
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