Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu Solder Joints
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概要
- 論文の詳細を見る
- 2009-04-01
著者
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Lee Hwa-teng
Department Of Mechanical Engineering National Cheng-kung University
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Lee Hwa-teng
Department Of Mechanical Engineering National Cheng Kung University
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HUANG Wen-Yeong
Department of Mechanical Engineering, National Cheng-Kung University
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Huang Wen-yeong
Department Of Mechanical Engineering National Cheng-kung University
関連論文
- Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu Solder Joints
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