Surface Integrity in Micro-Hole Drilling Using Micro-Electro Discharge Machining
スポンサーリンク
概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2003-12-01
著者
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Lee Hwa-teng
Department Of Mechanical Engineering National Cheng Kung University
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REHBACH Werner
Central Facility for Electron Microscopy, RWTH-Aachen
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TAI Tzu-Yao
Department of Mechanical Engineering, National Cheng Kung University
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HSU Fu-Chuan
Department of Mechanical Engineering, National Cheng Kung University
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Tai Tzu-yao
Department Of Mechanical Engineering National Cheng Kung University
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Hsu Fu-chuan
Department Of Mechanical Engineering National Cheng Kung University
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Rehbach Werner
Central Facility For Electron Microscopy Rwth-aachen
関連論文
- Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu Solder Joints
- Precipitated Phases and Corrosion Behavior in the Dissimilar Alloy 690-SUS 304L Joints Formed by EBW and GTAW
- Surface Integrity in Micro-Hole Drilling Using Micro-Electro Discharge Machining
- Fine Grains Forming Process, Mechanism of Fine Grain Formation and Properties of Superalloy 718