Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-08-01
著者
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Takemoto Tadashi
Collaborative Research Center For Advanced Science And Technology Osaka University
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FUNAKI Tatsuya
Osaka University, Presently at Murata Mfg. Co., Ltd.
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Takemoto Tadashi
Collaborative Research Center For Advanced Science And Technology Osaka Unibersity
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Funaki Tatsuya
Osaka University Presently At Murata Mfg. Co. Ltd.
関連論文
- Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting
- Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
- Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder