Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2001-05-20
著者
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Takemoto Tadashi
Collaborative Research Center For Advanced Science And Technology Osaka Unibersity
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MIYAZAKI Makoto
Collaborative Research Center for Advanced Science and Technology, Osaka Unibersity
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Miyazaki Makoto
Collaborative Research Center For Advanced Science And Technology Osaka Unibersity
関連論文
- Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting
- Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
- Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder