Defects in Electroplated Cu and their Impact on Stress Migration Reliability
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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Uedono A.
Institute Of Applied Physics University Of Tsukuba
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SUZUKI T.
Semiconductor Technology Academic Research Center (STARC)
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NAKAMURA T.
Semiconductor Technology Academic Research Center (STARC)
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OHDAIRA T.
National Institute of Advanced Industrial Science and Technology (AIST)
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SUZUKI R.
National Institute of Advanced Industrial Science and Technology (AIST)
関連論文
- Infusion Processing for Reliable Copper Interconnects
- Defects in Electroplated Cu and their Impact on Stress Migration Reliability