Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests

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概要

• 論文の詳細を見る
• 2006-09-13

著者

• Chang Shou-yi

  Department Of Materials Engineering National Chung Hsing University

• LEE Yu-Shuien

  Department of Materials Engineering, National Chung Hsing University

• Lee Yu-shuien

  Department Of Materials Engineering National Chung Hsing University

関連論文

• Chemical-Mechanical Lift-Off Process for InGaN Epitaxial Layers
• Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests
• Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests

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