MEMS Wafer Level Packaging by Using Surface Activated Bonding
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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TAKEGAWA Yoshiyuki
EMIT Devices Development Department, Matsushita Electric Works, Ltd.
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BABA Toru
EMIT Devices Development Department, Matsushita Electric Works, Ltd.
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OKUDO Takafumi
EMIT Devices Development Department, Matsushita Electric Works, Ltd.
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SUZUKI Yuji
Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd.
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Baba Toru
Emit Devices Development Department Matsushita Electric Works Ltd.
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Okudo Takafumi
Emit Devices Development Department Matsushita Electric Works Ltd.
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Takegawa Yoshiyuki
Emit Devices Development Department Matsushita Electric Works Ltd.
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Suzuki Yuji
Micro Fabrication Process Development Center Matsushita Electric Works Ltd.
関連論文
- MEMS Wafer Level Packaging by Using Surface Activated Bonding
- Wafer-Level Packaging for Micro-Electro-Mechanical Systems Using Surface Activated Bonding