Okudo Takafumi | Emit Devices Development Department Matsushita Electric Works Ltd.
スポンサーリンク
概要
- OKUDO Takafumiの詳細を見る
- 同名の論文著者
- Emit Devices Development Department Matsushita Electric Works Ltd.の論文著者
関連著者
-
Baba Toru
Emit Devices Development Department Matsushita Electric Works Ltd.
-
Okudo Takafumi
Emit Devices Development Department Matsushita Electric Works Ltd.
-
Takegawa Yoshiyuki
Emit Devices Development Department Matsushita Electric Works Ltd.
-
Suzuki Yuji
Micro Fabrication Process Development Center Matsushita Electric Works Ltd.
-
TAKEGAWA Yoshiyuki
EMIT Devices Development Department, Matsushita Electric Works, Ltd.
-
BABA Toru
EMIT Devices Development Department, Matsushita Electric Works, Ltd.
-
OKUDO Takafumi
EMIT Devices Development Department, Matsushita Electric Works, Ltd.
-
SUZUKI Yuji
Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd.
-
Suzuki Yuji
Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd., Kadoma, Osaka 571-8686, Japan
-
Baba Toru
EMIT Devices Development Department, Matsushita Electric Works, Ltd., Kadoma, Osaka 571-8686, Japan
-
Takegawa Yoshiyuki
EMIT Devices Development Department, Matsushita Electric Works, Ltd., Kadoma, Osaka 571-8686, Japan
-
Okudo Takafumi
EMIT Devices Development Department, Matsushita Electric Works, Ltd., Kadoma, Osaka 571-8686, Japan
著作論文
- MEMS Wafer Level Packaging by Using Surface Activated Bonding
- Wafer-Level Packaging for Micro-Electro-Mechanical Systems Using Surface Activated Bonding