New Low k Material "LKD^<TM>" for Al Damascene Process Application
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概要
- 論文の詳細を見る
- 1999-09-20
著者
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Seta S.
Ulsi Process Engineering Laboratory Toshiba Corporation
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Miyajima H.
Ulsi Process Engineering Laboratory Toshiba Corporation
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NAKATA R.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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KAWAI M.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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YAMADA N.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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HIGASHI K.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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ICHINOSE H.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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MATSUI Y.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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MINAMIHABA G.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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MATSUNAGA N.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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HAYASAKA N.
ULSI Process Engineering Laboratory, TOSHIBA CORPORATION
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Minamihaba G.
Ulsi Process Engineering Laboratory Toshiba Corporation
関連論文
- New Low k Material "LKD^" for Al Damascene Process Application
- Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs