Kinetic Features of Reactive Diffusion between Sn-5Au Alloy and Ni at Solid-State Temperatures
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2006-09-20
著者
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Kajihara Masanori
Department Of Materials Science And Engineering Tokyo Institute Of Technology
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YATO Yu-ichi
Department of Materials Science and Engineering, Tokyo Institute of Technology
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Yato Yu-ichi
Department Of Materials Science And Engineering Tokyo Institute Of Technology
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- Influence of Temperature Dependence of Solubility on Kinetics for Reactive Diffusion in a Hypothetical Binary System
- Numerical Analysis for Kinetics of Reactive Diffusion Controlled by Boundary and Volume Diffusion in a Hypothetical Binary System
- Reactive Diffusion between Ag and Sn at Solid State Temperatures
- Kinetics of Solid-State Reactive Diffusion between Au and Al
- Kinetic Features of Reactive Diffusion between Sn-5Au Alloy and Ni at Solid-State Temperatures
- Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb
- Numerical Analysis of Observations on Diffusion Induced Recrystallization in the Ni(Cu) System using A Kinetic Model
- Quantitative Evaluation of Interdiffusion in Fe_2Al_5 during Reactive Diffusion in the Binary Fe-Al System
- Temperature Dependence of Kinetics for Reactive Diffusion in a Hypothetical Binary System
- Observation on Isothermal Reactive Diffusion between Solid Fe and Liquid Sn
- Effects of Fe, W and Mo on Kinetics of Discontinuous Precipitation in the Ni-Cr System
- Solubility of NbC in a Ni-16Cr-8Fe Alloy.