Reactive Diffusion between Ag and Sn at Solid State Temperatures
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-05-20
著者
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Kano Satoru
Graduate School Tokyo Institute Of Technology
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Kajihara Masanori
Department Of Materials Science And Engineering Tokyo Institute Of Technology
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Sakamoto Katsuhiko
Tyco Electronics Amp Co. Ltd.
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SUZUKI Ken
Graduate School, Tokyo Institute of Technology
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KUROKAWA Noriharu
Tyco Electronics AMP Co., Ltd.
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Kurokawa Noriharu
Tyco Electronics Amp Co. Ltd.
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Suzuki Ken
Graduate School Tokyo Institute Of Technology
関連論文
- Fast Penetration of Cu in Ni of Cu/Ni/Cu Diffusion Couples Due to Diffusion Induced Recrystallization
- Influence of Ag on Kinetics of Solid-State Reactive Diffusion between Pd and Sn
- Solid-State Reactive Diffusion between Sn and Electroless Ni-P at 473K
- Reactive Diffusion between Ag-5Pt Alloy and Sn at Solid-State Temperatures
- Fast Penetration of Sn into Ag by Diffusion Induced Recrystallization
- Analysis for Kinetics of Austenite Growth due to Isothermal Carburization of Ferrite
- Orientation Relationship for Fine Grains Formed by Diffusion-Induced Recrystallization in the Ni(Cu) System
- Occurrence of Faceting for [110] Symmetric Tilt Boundaries in Cu Doped with Bi
- Analysis of Kinetics of Diffusion Induced Recrystallization in Fe Phase of Cu/Fe/Cu Diffusion Couples
- Experimental Study on Diffusion Induced Recrystallization in Cu/Fe/Cu Diffusion Couples Using Cu Single Crystals