Comparison of CVD and PVD TaN as Diffusion Barriers for Al and Cu Metallization
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概要
- 論文の詳細を見る
- 1995-08-21
著者
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Chiu H.
Institute Of Applied Chemistry National Chiao Tung University
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SUN S.
National Nano Device Laboratory National Chiao Tung University
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Tsai M.
National Nano Device Laboratory And Department Of Electronics Engineering
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Tsai C.
Institute Of Applied Chemistry National Chiao Tung University
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Sun S.
National Nano Device Laboratory And Department Of Electronics Engineering
関連論文
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- Comparison of CVD and PVD TaN as Diffusion Barriers for Al and Cu Metallization
- A Comparative Study of CVD and PVD Tungsten Nitride Diffusion Barriers for Cu Metallization