Dynamic Creep Behaviors of Si-Ti-C-O Ceramic Fiber Bonded Body under Bend Loading at Elevated Temperature(Strength & Material Evaluation)

概要

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Dynamic creep test and its analysis were performed for Si-Ti-C-O ceramic fiber bonded body under bend loading at 1400℃. Creep displacement under cyclic loading with mean stress σ_m1=196 MPa and stress amplitude σ_a=49 MPa is quite similar to the one under constant static load of σ_0=196 MPa, while the dynamic creep displacement under loading condition atσ_m1=245 MPa and σ_a=49 MPa is much larger than static creep displacement at σ_0=245 MPa. SEM observations revealed that the failure of matrix material was caused around the neutral plane of the specimen by cyclic shear stressing in the dynamic creep process at σ_m1=245 MPa and σ_a=49 MPa. Finite element method analysis was performed for the dynamic creep process, where the gradual attenuation of shear modulus G_12 with progress of dynamic creep was assumed. The calculation described qualitatively well the dynamic creep deformation behavior of this material. The normal stress distribution of the specimen and the shear stress distribution in the neutral plane along the specimen axis were presented on the basis of the FEM calculation.
一般社団法人日本機械学会の論文
2002-07-15