Low-Damage Damascene Patterning Using Porous Inorganic Low-Dielectric-Constant Materials
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-05-15
著者
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Fujiwara Nobuo
Wafer Process Engineering Development Division Renesas Technology Corporation
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YONEKURA Kazumasa
Wafer Process Engineering Development Division, Renesas Technology Corporation
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GOTO Kinya
Wafer Process Engineering Development Division, Renesas Technology Corporation
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MATSUURA Masazumi
Wafer Process Engineering Development Division, Renesas Technology Corporation
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TSUJIMOTO Kazunori
Wafer Process Engineering Development Division, Renesas Technology Corporation
関連論文
- Low-Damage Damascene Patterning Using Porous Inorganic Low-Dielectric-Constant Materials
- Low-Damage Damascene Patterning Using Porous Inorganic Low-Dielectric-Constant Materials