Reverse CoSi_2 Thermal Stability and Digitized Sheet Resistance Increase of Sub-90nm Polysilicon Lines
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-04-30
著者
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Lin Shyue-shyh
Advanced Logic-1 Logic Technology Division Taiwan Semiconductor Manufacturing Company Ltd.
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Chen Yen-ming
Advanced Logic-1 Logic Technology Division Taiwan Semiconductor Manufacturing Company Ltd.
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LO Cheng-Yao
Advanced Logic-1, Logic Technology Division, Taiwan Semiconductor Manufacturing Company, Ltd.
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PENG Yuan-Ching
Advanced Logic-1, Logic Technology Division, Taiwan Semiconductor Manufacturing Company, Ltd.
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CHEN Yen-Ming
Department of Materials Science and Engineering, National Chiao-Tung University
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TU George
Department of Materials Science and Engineering, National Chiao-Tung University
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CHEN Wei-Ming
Advanced Logic-1, Logic Technology Division, Taiwan Semiconductor Manufacturing Company, Ltd.
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Tu George
Department Of Materials Science And Engineering National Chiao-tung University
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Lo Cheng-yao
Advanced Logic-1 Logic Technology Division Taiwan Semiconductor Manufacturing Company Ltd.
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Chen Wei-ming
Advanced Logic-1 Logic Technology Division Taiwan Semiconductor Manufacturing Company Ltd.
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Peng Yuan-ching
Advanced Logic-1 Logic Technology Division Taiwan Semiconductor Manufacturing Company Ltd.
関連論文
- Reverse CoSi_2 Thermal Stability and Digitized Sheet Resistance Increase of Sub-90nm Polysilicon Lines
- Reverse CoSi_2 Thermal Stability and Digitized Sheet Resistance Increase in Sub-90nm Poly-Si Lines
- The Effect of Anodizing on the Corrosion Fatigue Behavior of 2024-T3 Aluminum Alloy