Sn-Zn-Alはんだのはんだ付け性と接合信頼性に関する研究

概要

論文の詳細を見る
We have implemented a company-wide effort to progressively reduce the use of lead and eventually eliminate this environmental pollutant from its products. As part of this effort, a new lead-free solder, which consists of tin, zinc, and aluminum,has been developed and also offers superior productivity and joint reliability. The new lead-free solder has a melting point equivalent to that of a tin-lead eutectic solder, and enables devices to be packaged at a lower temperature than the increasingly popular tin-silver-copper solder. Thus, the new lead-free solder accelerates the elimination of lead from products. We have already used PC boards containing the new lead-free solder in some products, and plans to extend its use to other products. This paper describes the characteristics of the new lead-free solder and the results of a study on its practical use.
社団法人エレクトロニクス実装学会の論文
2003-08-01