Effect of Phase Formation Behavior on Thermal Stability of Hafnium-Based Thin Films for Copper Interconnects
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-06-15
著者
-
Lin M‐h
Department Of Mechanical Engineering National Kaohsiung University Of Applied Sciences
-
LIN Ming-Hong
Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences
-
CHIOU Shi-Yung
Department of Mold and Die Engineering, National Kaohsiung University of Applied Sciences
関連論文
- Effect of Phase Formation Behavior on Thermal Stability of Hafnium-Based Thin Films for Copper Interconnects
- Effect of Phase Formation Behavior on Thermal Stability of Hafnium-Based Thin Films for Copper Interconnects