The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2004-03-20

著者

• Gosselin Timothy

  Ibm Microelectronics

• KANG Sung

  IBM, T. J. Watson Research Center

• LAURO Paul

  IBM, T. J. Watson Research Center

• SHIH Da-Yuan.

  IBM, T. J. Watson Research Center

• HENDERSON Donald

  IBM Microelectronics

• BARTELO Jay

  IBM Microelectronics

• CAIN Steve

  IBM Microelectronics

• GOLDSMITH Charles

  IBM Corporation

• PUTTLITZ Karl

  IBM Corporation

• HWANG Tae

  Korea Adv. Inst. Sci. & Tech., Daejeon

• CHOI Won

  Samsung Adv. Inst. Tech, Suwon

• Hwang Tae

  Korea Adv. Inst. Sci. & Tech. Daejeon

• Lauro Paul

  Ibm T. J. Watson Research Center

• Shih Da-yuan.

  Ibm T. J. Watson Research Center

• Kang Sung

  Ibm T. J. Watson Research Center

• Choi Won

  Samsung Adv. Inst. Tech Suwon

関連論文

• The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
• Vertical Light-Emitting Diode Fabrication by Controlled Spalling
• Vertical Light-Emitting Diode Fabrication by Controlled Spalling

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