Ultramicrotomy of Wire-bonded Interfaces for TEM Observation
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概要
- 論文の詳細を見る
- Published for the Japanese Society of Electron Microscopy by Oxford University Pressの論文
- 1995-06-01
著者
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NAKASHIMA Hideharu
Department of Electrical and Material Sciences, Faculty of Engineering Sciences, Kyushu University
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Itoh Y
Sumitomo Metal Ind. Ltd. Amagasaki Jpn
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Nakashima Hideharu
Department Of Materials Science And Technology Graduate School Of Engineering Science Kyushu Univers
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ITOH Yoshiko
Scientific Instruments Center, Nissei Sangyo Co., Ltd
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HAJO Hiroshi
Department of Materials Science and Technology, Graduate School of Engineering Science, Kyushu Unive
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KASHIDA Haruo
Scientific Instruments Center, Nissei Sangyo Co., Ltd
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Hajo Hiroshi
Department Of Materials Science And Technology Graduate School Of Engineering Science Kyushu Univers
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Kashida Haruo
Scientific Instruments Center Nissei Sangyo Co. Ltd
関連論文
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- Fracture Toughness Evaluated by Indentation Methods and Its Relation to Surface Energy in Silicon Single Crystals
- Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding
- Geometric Structures of Grain Boundaries Expected from the O-Lattice Theory Compared with High-Resolution Transmission Electron Microscope Images
- Ultramicrotomy of Wire-bonded Interfaces for TEM Observation
- Transient Creep in High-Purity Aluminum at Ultra-Low Strain Rate and Room Temperature by Constant Stress and Changing-Stress Experiments
- Low-Temperature Creep at Ultra-Low Strain Rates in Pure Aluminum Studied by a Helicoid Spring Specimen Technique
- Threshold Stress for High-Temperature Deformation of Dispersion-Strengthened Alloys.