Fracture Strength Measurement of Silicon Chips
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概要
- 論文の詳細を見る
- Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
- 1997-06-01
著者
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Lee Seong-min
Memory Product And Tecnology Memory Devision Semiconductor Samsung Electronics Co. Ltd.
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Lee Seong-min
Memory Division Semiconductor Samsung Electronics Co. Ltd.
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SIM Sung-Min
Memory Product and Tecnology, Memory Devision, Semiconductor, Samsung Electronics Co., Ltd.
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CHUNG Yong-Wuk
Memory Product and Tecnology, Memory Devision, Semiconductor, Samsung Electronics Co., Ltd.
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JANG Young-Kwan
Memory Product and Tecnology, Memory Devision, Semiconductor, Samsung Electronics Co., Ltd.
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CHO Hee-Kang
Memory Product and Tecnology, Memory Devision, Semiconductor, Samsung Electronics Co., Ltd.
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Sim Sung-min
Memory Product And Tecnology Memory Devision Semiconductor Samsung Electronics Co. Ltd.
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Chung Yong-wuk
Memory Product And Tecnology Memory Devision Semiconductor Samsung Electronics Co. Ltd.
-
Cho Hee-kang
Memory Product And Tecnology Memory Devision Semiconductor Samsung Electronics Co. Ltd.
-
Jang Young-kwan
Memory Product And Tecnology Memory Devision Semiconductor Samsung Electronics Co. Ltd.
関連論文
- Fracture Strength Measurement of Silicon Chips
- Cavitational Failure Phenomenon in Pb-Sn Eutectic Solders
- Fracture Strength Measurement of Silicon Chips