FORCED CONVECTIVE HEAT TRANSFER FROM A CHANNEL BETWEEN VERTICAL ELECTRONIC CIRCUIT BOARDS
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概要
- 論文の詳細を見る
Forced convection is sometimes employed in the cooling of electronic equipment operating at high heat dissipation rates. The heated electronic components are usually arranged evenly on the vertical circuit boards.To analyze the heat transfer of such electronic equipment, the forced convective heat transfer between two vertical parallel electronic circuit boards (ECBs) was investigated. The local heat transfer coefficient from the board was affected by the Reynolds number, the distance between the boards, and the distance from the channel entrance.Two empirical equations for calculating local Nusselt numbers for the heat transfer in a channel between vertical electronic boards were obtained. One was for an ECB surface with components, another was for its rear surface without components, and the range of Reynolds numbers was from 1500 to 9000.
- 社団法人 化学工学会の論文
- 1996-12-01
著者
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KATO Kunio
Department of Applied Quantum Physics and Nuclear Engineering, Kyushu University
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Kato Kunio
Department Of Biological And Chemical Engineering Gunma University
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NAKAGAWA Nobuyoshi
Department of Biological and Chemical Engineering, Gunma University
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Nakagawa N
Department Of Biological And Chemical Engineering Gunma University
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Nakagawa N
Gunma Univ. Kiryu Jpn
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Nakagawa Nobuyoshi
Department Of Biological And Chemical Engineering Gunma University
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JIAYU Xu
Department of Biological & Chemical Engineering, Gunma University
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SHIBUI Kumi
Department of Biological & Chemical Engineering, Gunma University
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Shibui Kumi
Department Of Biological & Chemical Engineering Gunma University
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Jiayu Xu
Department Of Biological & Chemical Engineering Gunma University
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Kato Kunio
Department Of Applied Quantum Physics And Nuclear Engineering Kyushu University
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Nakagawa Nobuyoshi
Department of Biological & Chemical Engineering, Gunma University
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