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the Department of Electronics and Electrical Engineering, Keio University | 論文
- Measurement of Inductive Coupling in Wireless Superconnect
- Chaotic Oscillation in a Microchip Solid-State Laser Array Using A Talbot Mirror(Special Section on Nonlinear Theory and its Applications)
- Constant Magnetic Field Scaling in Inductive-Coupling Data Link
- Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link(Analog and Communications,Low-Power, High-Speed LSIs and Related Technologies)
- Constant Magnetic Field Scaling in Inductive-Coupling Data Link
- 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique
- A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology (Interface and Interconnect Techniques, VLSI Design Technology in the Sub-100nm Era)
- 6W/25mm^2 Wireless Power Transmission for Non-contact Wafer-Level Testing