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Sharp Corp. Nara Jpn | 論文
- C-V Analysis of Electrical Properties for PN Heterointerface in InP/InGaAsP Double-Heterojunction Laser Diode
- Cortical Neurophysiological Modification after Peripheral Neuronal Sensitization
- Electrical Conduction near Percolation Threshold in Polymer Composite Containing Conducting Polypyrrole-Coated Insulating Polymer Fiber
- Electrical Conduction by Percolation Process in Insulating Polymer Containing Small Amount of Conducting Polymer
- Preparation and Electrical Property of Polypyrrole-Polyethylene Composite
- Thickness Dependence of Furnace N_2O-Oxynitridation Effects on Breakdown of Thermal Oxides
- On-orbit servicing and its breakthrough approach using small satellite : Rendezvous and fly-around technology for uncooperative target(WSANE2006)
- BS-6-12 Development of Equipments for Rendezvous Fly-around Experiments on SmartSat-1(BS-6.Observation, communication and positioning technology of equipments mounted on satellite, aircraft, ship and ground,ENGLISH SESSION)
- In Situ Rapid Thermal Nitridation of Collimated Titanium by Physical Vapor Deposition as a Blanket Tungsten Barrier
- High Density Recording Capability of Laser-Assisted Magnetic Recording
- Antimony Aperture Properties on Super-Resolution Near-Field Structure using Different Protection Layers
- The Near-Field Super-Resolution Properties of an Antimony Thin Film
- Proposal of Cryogenic Plasmas in Liquid Helium II
- Possible Existence of a Transient Superfluid Plasma in Liquid Helium II
- Growth of ZnO on Sapphire (0001) by the Vapor Phase Epitaxy Using a Chloride Source
- Moon Tracking Attitude Control Experiment of a Bias Momentum Micro Satellite "μ-LabSat"
- SB-8-5 In-orbit Demonstration of Orbital Maintenance System Using COTS Technologies(Small Satellite 1)(SB-8. Results of Various Satellite Missions)
- VISUAL FEEDBACK ATTITUDE CONTROL EXPERIMENT OF A BIAS MOMENTUM MICRO SATELLITE
- Preliminary experiments on technologies for satellite orbital maintenance using Micro-LabSat 1
- Low Resistance and Thermally Stable Ti-Silicided Shallow Junction Formed by Advanced 2-Step Rapid Thermal Processing and Its Application to Deep Submicron Contact