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Semiconductor Research Center, Matsushita Electric Industrial Co., Lid. | 論文
- A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
- Tunnel Structured Stacked Capacitor Cell (TSSC) with High Reliability for 64 Mbit dRAMs and Formation of Oxide-Nitride-Oxide Film (ONO) on 3-dimensionally (3d) Storage Electrode
- An Npn AlGaAs/GaAs Collector-up HBT with an H^+ -Implanted High Resistivity Layer under the External p^+ -GaAs Base