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Samsung Electronics Co. Ltd. | 論文
- Metamaterial-Based Microstrip Antenna Using Slot-Embedded Ground Plane for Bandwidth Improvements
- Linearly Tapered Slot Antenna with Defected Sides for Gain Improvement
- Synchronous Pulse Plasma Operation upon Source and Bias Radio Frequencys for Inductively Coupled Plasma for Highly Reliable Gate Etching Technology
- Autocorrelation of New Generalized Cyclotomic Sequences of Period p^n
- Contact Series Resistance in Hydrogenated Amorphous Silicon Thin Film Transistor
- Circularly Polarized Microstrip Antenna with Reconfigurable Capability Using Ground Slot Perturbations
- File Trust : Reputation Management for Reliable Resource Sharing in Structured Peer-to-Peer Networks(Networks Software)
- Real Time Monitoring of NH_3 Concentration Using Diffusion Scrubber Sampling Technique and Result of Application to the Processing of Chemically Amplified Resists
- Performance Evaluation of Uplink MC-CDMA Systems with Residual Frequency Offset(Wireless Communication Technologies)
- Study on sloshing in cargo tanks including hydroelastic effects
- Pixel Design for TFT-LCD with Double Gate Poly-Si TFT and Double Layer Storage Capacitor
- Investigation of the AGA Effect on Performance Analysis of an MPIC
- Average BER Analysis for Multicode 64-QAM CDMA Systems with an MPIC
- Adaptive Supply Voltage for Low-Power Ripple-Carry and Carry-Select Adders(Electronic Circuits)
- The Effects of Thermosolutal Convection on Macrosegregation during Alloy Solidification
- Performance of Superposition Coded Broadcast/Unicast Service Overlay System
- An Efficient Resource Allocation Scheme for VoIP Services in the IEEE 802.16e OFDMA System
- Hybrid Schemes and Variable-Size Subblock TLBs : Aggressive Superpage Supports
- Analysis of Microstrip Line with Bends Using Fourier Transform and Mode-Matching Technique
- Mechanism and CHARM2 Evaluation of P-Channel Metal Oxide Semiconductor Threshold Voltage Drop during High Density Plasma Heat-up Process