スポンサーリンク
NTT Microsystem Integration Laboratories, Atsugi, Kanagawa 243-0198, Japan | 論文
- Selective Removal of Dry-Etching Residue Derived from Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
- Correlation between Adhesive Strength and the Oxidized and Reduced States of Pt Films Electron Cyclotron Resonance Plasma Sputtered on SiO2
- Removal of Gold Oxide by Low-Temperature Hydrogen Annealing for Microelectromechanical System Device Fabrication
- Photoluminescence from Eu