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NEC Corporation, ULSI Device Development Laboratories | 論文
- "H_2O-TOP-PECVD" : A New Plasma Enhanced CVD Technology Using Alternate TEOS-Ozone Low Pressure CVD and H_2O Assisted O_3 Plasma Treatment
- A Reliable Double Level Interconnection Technology for Giga Bit DRAMs Using SiO_2 Mask Al Etching and PECVD SiOF