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Institute of Advanced Material Study | 論文
- Effect of Surface Microstructure on Boiling Heat Transfer from Silicon Chips Immersed in FC-72
- D301 COMPUTER SIMULATION OF THERMAL CONTACT CONDUCTANCE BASED ON RANDOM NUMBERS(Molecular dynamics)
- Air Cooling of an Electronic Chip Module : Conjugate Heat Transfer Analysis
- Research on Fluid Elastic Vibration of Cylinder Arrays by Computational Fluid Dynamics : Analysis of Two Cylinders and a Cylinder Row
- A Numerical Analysis of Free Convection Around an Isothermal Sphere (Effects of Space and Prandtl Number)
- A Method for Measuring Thermal Conductivity of Fluids by Using a Small Bead Thermistor
- Numerical Simulation of Thermal Contact Resistance using Non-dimesional Parameters
- Numerical Simulation of Thermal Contact Resistance : A New Calculation Method in Cylindrical Coordinates
- Effect of the Size of Micro-Pin-Fin on Boiling Heat Transfer from Silicon Chips Immersed in FC-72
- MEASUREMENTS OF THERMOPHYSICAL PROPERTIES UNDER MICRO-GRAVITY CONDITION(Abstract from International Seminar on Manufacturing of Advanced Materials)