スポンサーリンク
Graduate School of Shibaura Institute of Technology | 論文
- Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evaluated by Micro Size Specimen
- Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
- Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint