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Department Of Mechanical Engineering Chung-ang University | 論文
- Experimental and Semi-analytical Study of Wear Contour of Roll Groove and Its Applications to Rod Mill
- An Approximate Model for Local Strain Variation over Material Thickness and Its Applications to Thick Plate Rolling Process
- A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
- 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
- Static and Metadynamic Recrystallization of Interstitial Free Steels during Hot Deformation
- Effect of the Roll Surface Profile on Centerline Segregation in Soft Reduction Process