Ando Tatsuya | Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
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- Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japanの論文著者
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan | 論文
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 μm Pitch