スポンサーリンク
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan | 論文
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 μm Pitch