DAIGUJI Hisaaki | Department of Mechanical Engineering, Tohoku University
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概要
Department of Mechanical Engineering, Tohoku University | 論文
- Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves(Advanced Technology of Experimental Mechanics)
- A Method for Sizing Small Fatigue Cracks in Stainless Steel Using Microwaves(Special Issue on strength and Fracture, and Experimental Mechanics)
- Application of Microwaves for Nondestructive and High-Efficiency Detection of Wall Thinning Locations in a Long-Distance Metal Pipe
- Microwave Atomic Force Microscopy : Quantitative Measurement and Characterization of Electrical Properties on the Nanometer Scale
- Room-Temperature Bonding Technique Based on Copper Nanowire Surface Fastener