篠嶋 妥 | Dep. Of Materials Sci. And Engineering Ibaraki Univ.
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概要
Dep. Of Materials Sci. And Engineering Ibaraki Univ. | 論文
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- High-Temperature Thick Al Wire Bonding Technology for High-Power Modules
- High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
- Development of A New High-Frequency, High-Peak Current Power Source for High Constricted Arc Formation
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms