Takeuchi Nobunao | Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre
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Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre | 論文
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
- Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
- Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires