Jung Jae‐pil | Department Of Materials Science And Engineering University Of Seoul
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概要
Department Of Materials Science And Engineering University Of Seoul | 論文
- Reliability of Sn-8mass%Zn-3mass%Bi Lead-Free Solder and Zn Behavior
- Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
- Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders
- A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
- Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere