Kim Y‐s | Department Of Materials Science And Engineering Hongik University
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概要
Department Of Materials Science And Engineering Hongik University | 論文
- Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys
- Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films
- Electrical Characteristics of the Pt/SrBi_Ta_2O_9/ZrO_2/Si Structure for Metal-Ferroelectric-Insulator-Semiconductor Field-Effect-Transistor Application
- Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint
- Pectolinarin and Pectolinarigenin of Cirsium setidens Prevent the Hepatic Injury in Rats Caused by D-Galactosamine via an Antioxidant Mechanism(Pharmacognosy)